WEI Juan
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China;University of Chinese Academy of Sciences, Beijing 100059, ChinaSUN Yu
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaXUE Haiyun
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaHE Huimin
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaSUN Siwei
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaLIU Fengman
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, ChinaCAO Liqiang
System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China1. System Packaging and Integration Research Center, Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China;2. University of Chinese Academy of Sciences, Beijing 100059, China
WEI Juan, SUN Yu, XUE Haiyun, HE Huimin, SUN Siwei, LIU Fengman, CAO Liqiang. A novel dual-lens-coupling system for DFB laser based on hybrid integration[J]. Optoelectronics Letters,2021,17(7):395-399
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