TIAN Chao
State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China;Semiconductor Manufacturing North China Beijing Corporation, Beijing 100176, ChinaGUO Shu-xu
State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, ChinaLIANG Jing-qiu
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, ChinaLIANG Zhong-zhu
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, ChinaGAO Feng-li
State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China1. State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China;2. Semiconductor Manufacturing North China (Beijing) Corporation, Beijing 100176, China;3. Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China
TIAN Chao, GUO Shu-xu, LIANG Jing-qiu, LIANG Zhong-zhu, GAO Feng-li. Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device[J]. Optoelectronics Letters,2017,13(4):282-286
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