Application of UV depth lithography in micro system technology
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TN256

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    Abstract:

    This letter reports on new types of photo resists allowing UV-light exposure of thick layers. Optimized processes Cthat for the positive resistAZ 9260 and the negative resist Epon SU-8 have been developed enabling the fabrication of high aspect ratio metallic and polymer micro components. The high potential of this technology will be demonstrated on the basis of two examples, a variable reluctance micro motor with compensated attractive force and an optical microphone developed for application in electro-magnetic interference en environments.

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Stephanus Büttgenbach, Marco Feldmann. Application of UV depth lithography in micro system technology[J]. Optoelectronics Letters,2008,4(1):1-4

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  • Received:August 21,2007
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